1/4 rev. a structure silicon monolithic integrated circuit product name compound led driver for cellular phone type BD6091GU features boost dc/dc for led back lighting constant current driver for led back lighting auto luminous control (alc) absolute maxi mum ratings ta = 2 5 parameter symbol limits unit pins maximum voltage 1 vmax1 7 v except for vled, vout, sw maximum voltage 2 vmax2 15 v vled maximum voltage 3 vmax3 32.6 v vout, sw power dissipation pd 1250 mw operating temperature range topr -40 ~ +85 o c storage temperature range tstg -55 ~ +150 o c note power dissipation deleting is 10mw/ o c, when it?s used in over 25 o c. (it?s deleting is on the board that is rohm?s standard) dissipation by lsi should not exceed tolerance level.of pd. operating conditions vbat R vio, ta=-30 85 parameter symbol limits unit vbat input voltage vbat 2.7 5.5 v vio pin voltage vio 1.65 3.3 v * radiation-proof is not designed.
2/4 rev. a electrical characteristics (unless otherwise specified, ta=25c, vbat=3.6v, vio=1.8v) parameter symbol min. typ. max. unit condition circuit current vbat circuit current 1 ibat1 0.1 1.0 a resetb=0v, vio=0v vbat circuit current 2 ibat2 0.5 3.0 a resetb=0v, vio=1.8v vbat circuit current 3 ibat3 - 2.5 5.0 ma led=on, iled=15ma setting vo=24v vbat circuit current 4 ibat4 - 0.4 1.0 ma only alc block on adcyc=0.52s setting except sensor current led driver led current step (setup) iledstp1 128 step led current step (at slope) iledstp2 256 step led maximum current imaxwled - 25.6 - ma led current accuracy iwled -7% 15 +7% ma i led =15ma setting dc/dc vled pin feedback voltage vfb - 0.3 - v over current protection ocp - 650 - ma oscillator frequency fosc 0.8 1.0 1.2 mhz over voltage protection detect voltage ovp1 30 31 32 v ovp2 - 27 - v ovp3 - 24 - v ovp4 - 21 - v ovp5 - 18 - v maximum duty mduty 92.5 - - % vout open protection ovo - 0.7 1.4 v i 2 c input (sda, scl) low level input voltage vil -0.3 - 0.25 vio v high level input voltage vih 0.75 vio - vbat +0.3 v hysteresis of schmitt trigger input vhys 0.05 vio - - v low level output voltage (sda) at 3ma sink current vol 0 - 0.3 v input current lin -3 - 3 a input voltage = 0.1vio~0.9vio resetb low level input voltage vil -0.3 - 0.25 vio v high level input voltage vih 0.75 vio - vbat +0.3 v input current iin -3 - 3 a input voltage = 0.1vio~0.9vio alc sbias output voltage vos 2.850 3.0 3.150 v io=200 a < initial value > 2.470 2.6 2.730 v io=200 a sbias output current ios - - 30 ma vo=3.0v ssens input range viss 0 - vos x 255/256 v sbias discharge resister at off roffs - 1.0 1.5 k ? adc resolution adres 8 bit adc non-linearity error adinl -3 - +3 lsb adc differential non-linearity error addnl -1 - +1 lsb ssens input impedance rssens 1 - - m ?
3/4 rev. a electrical characteristics (unless otherwise specified, ta=25c, vbat=3.6v, vio=1.8v) wpwmin l level input voltage vila -0.3 - 0.3 v h level input voltage viha 1.4 - vbat +0.3 v input current iina - 3.6 10 a vin=1.8v pwm input minimum high pulse width pwpwm 50 - - s gc1, gc2 l level output voltage vols - - 0.2 v iol=1ma h level output voltage vohs vos -0.2 - - v ioh=1ma outside size figure vcsp85h3 24pin unit:mm lot no. bd6091
4/4 rev. a block diagram pin list cautions on use (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break d own devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absol ute maximum ratings is assumed, consideration should be given to take physi cal safety measures including the use of fuses, etc. (2) power supply and ground line design pcb pattern to provide low impedance for the wiring between the power supply and the ground lines. pay attention to the interference by common impedance of layout pattern when there are plural power supplies and ground lines. especially, when there are ground pat tern for small signal and ground pattern for large current included the external circuits, please separate each ground pattern. furtherm ore, for all power supply pins to ics, mount a capacitor between the power s upply and the ground pin. at the same time, in order to use a ca pacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropou t at a low temperature, thus determining the constant. (3) ground voltage make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state. furthermor e, check to be sure no pins are at a potential lower than the ground voltage including an actual electric transient. (4) short circuit between pins and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign ma tters entering between pins or between the pin and the power suppl y or the ground pin, the ics can break down. (5) operation in strong electromagnetic field be noted that using ics in the strong electromagnetic field can malfunction them. (6) input pins in terms of the construction of ic, parasitic elements are inevitably formed in relation to potential. the operation of the par asitic element can cause interference with circuit operation, thus resulting in a malfunc tion and then breakdown of the input pin. therefore, pay thorou gh attention not to handle the input pins, such as to apply to the input pins a voltage lower than the ground respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. in addition, even if the power supp ly voltage is applied, apply to the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characterist ics. (7) external capacitor in order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. (8) thermal shutdown circuit (tsd) this lsi builds in a thermal shutdown (tsd) circuit. when junction temperatures become detection temperature or higher, the the rmal shutdown circuit operates and turns a switch off. the thermal s hutdown circuit, which is aimed at isolating the lsi from therma l runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefore, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (9) thermal design perform thermal design in which there are adequate margins by taki ng into account the permissible dissipation (pd) in actual st ates of use. (10) about the pin for the test, the un-use pin prevent a problem from being in the pin for the test and the un- use pin under the state of actual use. please refer to a functi on manual and an application notebook. and, as for the pin that doesn't spec ially have an explanation, ask our company person in charge. (11) rush current rush current may flow in instant in the internal logic unfix ed state by the power supply injection order and delay. therefore, be careful of power supply coupling capacity, a power supply and the width of grand pattern wiring, and leading about. (12) dc/dc converter please select the low dcr inductors to decrease power loss for dc/dc converter. pin pin name pin pin name a2 vbat1 b1 wpwmin d5 vbat2 e4 sw d1 vio c3 vout c1 gnd1 a4 vled e2 gnd2 b4 sbias a3 ledgnd b5 ssens e3 gndp b3 gc1 d4 gndps c4 gc2 c5 sgnd a1 t1 d3 resetb a5 t2 c2 sda e5 t3 d2 scl e1 t4 resetb scl sd a wpwmin t1 t2 t3 t4 i/o i 2 c interface iref ledgnd digital control vref level shift vio sensor i/f sbias sgnd gc1 gc2 alc vbat1 sw gndp vout gndp feed back vled dc/dc external pwm gnd1 tsd ocp ovp gnd2 ssens vbat2
appendix-rev4.0 thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact your nearest sales office. rohm customer support system the americas / europe / asia / japan contact us : webmaster@ rohm.co. jp www.rohm.com copyright ? 2009 rohm co.,ltd. 21 saiin mizosaki- cho, ukyo-ku, kyoto 615-8585, japan tel : +81-75-311-2121 fax : +81-75-315-0172 appendix notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when de signing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no re- sponsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exer cise intellectual property or other rights held by rohm and other parties. rohm shall bear no re- sponsibility whatsoever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, elec- tronic ap pliances and amusement devices). the products are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possi bility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which re quires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intend- ed to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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